the module to operate at temperatures beyond

With dimensions of 5 mm by 4 mm by 1.85 mm thick, Avago’s new compact 1-Watt (1W) ASMT-Jx1x is capable of being driven at 350 mA to provide high flux output performance. The company says that the reliable LED with a wide viewing angle has moisture sensitivity level-one (MSL 1) capability. According to the company, the competitively priced LED is ideal for applications portable lighting appliances, street lighting, architectural facade lighting, retail display lighting, backlighting and specialty lighting applications.

Despite its compact size, the ASMT-Jx1x provides a maximum viewing angle of 165-degrees to meet the needs of designers who require good color and light output uniformity in their lighting applications. Avago’s ASMT-Jx1x is a high performance LED designed to handle high thermal and high drive currents. By delivering a high flux output of up to 87 lumens (lm) at 350mA, this LED features a maximum allowable junction temperature of 150 degrees-C and high Electrostatic Discharge (ESD) resistance of 16 kV which makes this LED insensitive to ESD. As a result, special ESD protection equipment is not required to handle the part during installation. Moreover, this 1W LED is compatible with standard SMT reflow soldering processes and helps lower design cost while providing lighting designers with more freedom and flexibility in designing their applications.The combination of advanced SiC devices and innovative package design allows the module to operate at temperatures beyond those achievable with a silicon IGBT-based module.

Development of the SiC power module was funded by AFRL. It features Cree high-current SiC MOSFETs and SiC Schottky diodes, which were developed under contracts from Army Research Laboratory (ARL). The SiC MOSFETs are normally-off devices and have drive requirements equivalent to the silicon IGBT devices they replace, making the SiC module a potential drop-in replacement for most applications. The all-SiC power switch module can be an enabling technology for next-generation military aircraft and future Army combat systems. This combination of Cree SiC devices and Powerex packaging technology could also lead to smaller, lighter-weight systems with reduced cooling requirements, while simultaneously offering increased reliability and overload capacity due to its high-temperature operation capability.

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