Leading lighting manufacturers profit considerably from this new technology as regards their LED products
The demands placed on electronic systems are continually growing, whilst the systems themselves are become ever smaller and increasingly complex. Heraeus‘ reaction to this ongoing trend towards miniaturization has been to develop a sophisticated smart solution. The SCB technology is specially designed for small circuits. Its use means that various differing metal/ plastic combinations can be structured and laminated in their millions in an extremely efficient manufacturing process.
For many years now stamped metal substrates made by Heraeus have been widely used as component carriers in the electronic branch. Based on this experience, the SCB technology goes a step further and combines structured metal layers with layers of likewise structured plastic. Similar to printed circuit boards, this multilayer structure may comprise glass fiber reinforced epoxy resin and copper. However, the separate structuring of the two materials allows for completely new design concepts. The manufacturing process in itself is also quite different. For a start the plastic and the metal are processed on separate reels. In accordance to the corresponding requirements the materials are structured whilst being stamped and then subsequently joined together in a perfect fit during lamination. If a special surface is needed for future specific applications then this is possible through electroforming. All of the production stages run in a highly efficient reel to‐ reel process.
Leading lighting manufacturers profit considerably from this new technology as regards their LED products. Luminous flux, efficiency and lifespan of LEDs depend to a large extent on their own junction temperature. Thus, any increase in the component temperature will have a negative effect on the performance of the LED. As such, it is obvious that an ingeniously devised thermal management system is something of tremendous significance. The SCB technology, as chip carrier, makes a decisive contribution towards the electrical and thermal properties and assumes a key role in the deployment of a wide variety of thermally conductive metals respectively metal alloys. The advantages of SCB technology are apparent: SCB is the optimal circuit board technology for small‐circuitry design.
For many years now stamped metal substrates made by Heraeus have been widely used as component carriers in the electronic branch. Based on this experience, the SCB technology goes a step further and combines structured metal layers with layers of likewise structured plastic. Similar to printed circuit boards, this multilayer structure may comprise glass fiber reinforced epoxy resin and copper. However, the separate structuring of the two materials allows for completely new design concepts. The manufacturing process in itself is also quite different. For a start the plastic and the metal are processed on separate reels. In accordance to the corresponding requirements the materials are structured whilst being stamped and then subsequently joined together in a perfect fit during lamination. If a special surface is needed for future specific applications then this is possible through electroforming. All of the production stages run in a highly efficient reel to‐ reel process.
Leading lighting manufacturers profit considerably from this new technology as regards their LED products. Luminous flux, efficiency and lifespan of LEDs depend to a large extent on their own junction temperature. Thus, any increase in the component temperature will have a negative effect on the performance of the LED. As such, it is obvious that an ingeniously devised thermal management system is something of tremendous significance. The SCB technology, as chip carrier, makes a decisive contribution towards the electrical and thermal properties and assumes a key role in the deployment of a wide variety of thermally conductive metals respectively metal alloys. The advantages of SCB technology are apparent: SCB is the optimal circuit board technology for small‐circuitry design.
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